We provide wafer-level packaging solutions that enhance Laser Beam Scanning applications, elevating MEMS mirror-based products through tailored dome-shaped packages.
These packages are designed to optimize optical performance, incorporating vacuum-sealed mirror operations that enhance long-term durability by protection against moisture and other environmental factors. The high-pressure vacuum sealing eliminates air damping, resulting in superior mirror oscillation, an expanded field of view, and reduced energy consumption.
Alongside tailored consulting and access to industry experts, we offer a holistic perspective on technology, applications, and markets. This empowers our customers to seize new opportunities and lead in future product categories.
Packaging Solutions
6 and 8-inch wafers with 400 to 700 packages per wafer and optional anti-reflective coatings
Consulting
Tailored advice on MEMS mirror technologies, applications, and markets
Open Innovation
Innovation projects in materials science and process development in academia context and OEM research
IP Solutions
Licensing and advisory services for packaged MEMS mirrors and packaging technologies